| Category | Details |
|---|---|
| Layer Count | Single-sided to 24 layers |
| Hybrid Stack-Ups | Hybrid stack-ups with PTFE and non-PTFE |
| Surface Finishes | ENIG, immersion tin, OSP and more |
| Sequential Lamination | Up to 4 cycles |
| Aspect Ratio for Microvias | 0.75:1 |
| Aspect Ratio for Through-Holes | 10:1 |
| Minimum Hole Diameters | 5 mil for mechanical drill and 3.5 mil for laser drill |
| Back Drilling | Minimum 12-mil hole and +/-1 mil depth tolerance |
| Tolerances | +0.5 mil for laser routing and +/-3 mil for mechanical routing |
| Gold Plating | Selective and full-body hard and soft gold plating up to 120µ |
| Additional Capabilities | Countersink holes; Castellations; Cavities; Edge plating; Buried via / blind via / microvia; Gold fingers |
